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5 дней назад

Internship Position (Digital Signoff Group)

Формат работы
onsite
Тип работы
fulltime
Грейд
trainee
Английский
b2
Страна
Ireland
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Internship Position (Digital Signoff Group) (Semiconductor EDA/Physical Verification): Testing, validating, and improving Pegasus physical verification flows for semiconductor signoff with an accent on DRC, LVS, manufacturing verification, and test automation. Focus on analyzing verification results, reproducing customer issues, debugging with R&D teams, and qualifying new process technologies.

Location: Cork, Ireland

Company

hirify.global is a global technology company developing Electronic Design Automation software for semiconductor design and manufacturing.

What you will do

  • Test and validate Pegasus physical verification flows and new product features.
  • Develop and execute verification test cases for product quality and robustness.
  • Analyze verification results, investigate issues, and reproduce customer-reported problems.
  • Debug and resolve technical issues with Product Engineering and R&D teams.
  • Support qualification of semiconductor process technologies and design rules.
  • Create automation scripts, technical documentation, reports, and presentations.

Requirements

  • Currently pursuing a Bachelor’s, Master’s, or PhD degree in Electronic Engineering, Computer Engineering, Computer Science, or a related discipline.
  • Strong analytical, problem-solving, communication, teamwork, and attention-to-detail skills.
  • Knowledge of semiconductor design, IC layout, or EDA tools.
  • Willingness to learn new technologies.

Nice to have

  • Basic programming or scripting experience with Python, Shell, Perl, or similar technologies.
  • Familiarity with Linux or Unix environments.

Culture & Benefits

  • Exposure to advanced semiconductor design and verification technologies.
  • Experience contributing to real-world projects used by semiconductor companies.
  • Mentorship from Product Engineering and R&D professionals.
  • Opportunities to contribute to advanced process nodes and next-generation chip design.
  • Collaboration in a multicultural engineering environment with teams across Europe, Asia, and North America.

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