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10 дней назад

Product Applications Engineer (Semiconductor/Laser Annealing)

100 183 - 126 900$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Product Applications Engineer (Semiconductor/Laser Annealing): Developing production-ready laser annealing applications for advanced semiconductor manufacturing with an accent on process integration, customer process challenges, and experimental data analysis. Focus on validating process solutions, standardizing process-control methods, and collaborating with engineering, service, product management, and sales teams.

Location: Taylor/Austin, Texas, United States; eligible to work in and travel throughout customer locations within the United States and globally. The role requires up to 30% domestic and international travel.

Salary: $100,183.00–$126,900.00 per year, plus bonus opportunity.

Company

hirify.global designs, develops, manufactures, and services complex equipment used by technology companies to solve material science challenges and manufacture advanced digital devices.

What you will do

  • Lead development of laser annealing applications that improve semiconductor device performance, yield, and manufacturability.
  • Translate customer process challenges into validated production solutions and accelerate adoption of laser processing technologies.
  • Establish best-known methods for process development, process control, and continuous improvement.
  • Evaluate process performance using system diagnostics, experimental data, and statistical analysis.
  • Resolve technical problems cross-functionally with engineering, service, product management, sales, and marketing.
  • Present technical findings and train customers and internal teams on process methodology, system operation, and application best practices.

Requirements

  • Bachelor’s degree in materials science, physics, chemistry, chemical engineering, electrical engineering, mechanical engineering, or a related technical discipline.
  • At least 5 years of experience in semiconductor process engineering, applications engineering, process integration, or a related industry.
  • Experience supporting semiconductor manufacturing, technology development, or process engineering programs.
  • Experience with semiconductor process integration in advanced logic, memory, or related device technologies.
  • Knowledge of laser annealing, rapid thermal processing, ion implantation, or other advanced thermal processing techniques.
  • Must be eligible to work in the United States and travel to customer locations in the United States and globally.

Culture & Benefits

  • Entrepreneurial culture supporting new product development and technical ownership.
  • Medical, dental, and vision coverage.
  • 401(k) with company match.
  • Holiday, vacation, sick time, flexible spending accounts, and commuter benefits.
  • Life, accident, and disability insurance, tuition reimbursement, employee assistance, and emergency travel assistance.

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