Engineer/Scientist Packaging - R&D (Semiconductor)

Location: Vaudreuil-Dorion, Quebec, Canada

Company

hirify.global develops photonic technologies for illumination, optical, detection, and imaging applications across biomedical, semiconductor, industrial, consumer, scientific, security, defense, and aerospace markets.

What you will do

• Design hermetic, quasi-hermetic, and non-hermetic packages for semiconductor lasers and photodetectors.
• Create thermal and stress simulation models and define assembly and test fixtures.
• Develop assembly processes, coordinate prototype assembly, and support product transfer to production.
• Create bills of materials, routings, drawings, and evaluation or qualification reports.
• Plan and conduct product evaluation and qualification against applicable standards.
• Collaborate with suppliers, product managers, application engineers, and customers on specifications, costing, feasibility, and product definition.

Requirements

• Bachelor’s or master’s degree in mechanical, electrical, physics engineering, or an equivalent field.
• Proficiency with SolidWorks and knowledge of ANSYS.
• Experience with electro-optical components, reliability testing, quality control, technology transfer, and related documentation.
• Knowledge of TO, PCB, ceramic substrate, and lead-frame assembly technologies.
• Strong data analysis, communication, motivation, and ability to work independently and across multiple projects.
• Written and spoken French and English are required for communication with international sites and customers.

Nice to have

• Membership in the OIQ.
• Knowledge of electrical and electronic engineering.

Culture & Benefits

• Regular full-time employment.
• Work within a global technology organization serving multiple photonics and industrial markets.
• Participation in the full product life cycle, from development through production support.