10 дней назад
ATE Hardware Design - Principal Engineer
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
ATE Hardware Design - Principal Engineer (ATE/semiconductor test hardware): Designing, integrating, validating, and supporting load boards, probe cards, sockets, and related interfaces for wafer sort and final test with an accent on signal integrity, power integrity, manufacturability, and reliability. Focus on leading end-to-end hardware development, solving complex electrical issues, coordinating suppliers and cross-functional teams, and delivering test solutions for high-volume manufacturing.
Location: Hsinchu, Taiwan
Company
develops semiconductor products and supports advanced test hardware for new-product introduction and high-volume manufacturing.
What you will do
- Own the complete ATE test hardware lifecycle from requirements and architecture through design, validation, release, and production support.
- Design and review load boards, probe cards, sockets, and related interfaces for wafer sort and final test.
- Lead schematic design, PCB stack-up, component placement, routing, design reviews, SI/PI analysis, simulation, bring-up, and debugging.
- Drive root-cause analysis, corrective actions, manufacturability, reliability, and first-time-right execution.
- Coordinate technical alignment, quality, cost, risk, and schedule across test engineering, product engineering, operations, quality, procurement, and suppliers.
- Define reusable design methodologies and provide technical leadership, mentoring, and supplier guidance.
Requirements
- At least 10 years of relevant ATE test hardware design and development experience in the semiconductor industry.
- Bachelor’s or Master’s degree in Electrical Engineering, Electronics Engineering, Computer Engineering, or a related discipline.
- Strong knowledge of semiconductor back-end assembly and test operations, wafer sort, final test, ATE architecture, and high-volume manufacturing.
- Hands-on experience with Advantest V93000, EXA Scale, Teradyne J750, UltraFLEX, UltraFLEXplus, or comparable ATE platforms.
- Expertise in high-speed digital design, signal integrity, power delivery and integrity, PMIC applications, multilayer PCB design, layout, validation, and design-for-manufacturability.
- Effective written and verbal English communication skills and the ability to lead cross-functional work independently.
Nice to have
- Experience with digital, mixed-signal, high-speed, RF, or power-management semiconductor products.
- Experience with technical roadmaps, design automation, reusable design checks, or standardized hardware methodologies.
- Established relationships with PCB, probe-card, socket, and test hardware suppliers.
Culture & Benefits
- Collaboration with global and multicultural engineering, operations, quality, procurement, and supplier teams.
- Opportunity to influence test hardware standards and technology planning across projects and sites.
- Full-time role focused on new-product development and high-volume manufacturing.
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