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12 дней назад

Principal Digital Design Engineer (PCIe)

Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
Taiwan
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

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TL;DR
Principal Digital Design Engineer (PCIe): Architecting and implementing complex digital blocks and subsystems for high-performance connectivity solutions with an accent on micro-architecture, RTL design, timing closure, and DFT. Focus on driving block ownership from architecture through GDS, collaborating on verification and silicon bring-up, and delivering advanced-node designs to production.

Location: Taipei, Taiwan

Company

hirify.global develops rack-scale AI infrastructure and semiconductor-based connectivity solutions integrating CXL, Ethernet, NVLink, PCIe, and UALink technologies with its COSMOS software suite.

What you will do

  • Define micro-architectures and implement complex digital blocks and subsystems.
  • Own block-level design from architecture through GDS, including RTL coding, simulation, synthesis, and production delivery.
  • Collaborate with verification teams on test plans, coverage closure, and complex debug.
  • Drive timing closure, gate-level simulation, and Design-for-Test implementation.
  • Support silicon bring-up, failure analysis, and post-silicon debug.
  • Mentor junior engineers and improve silicon development processes.

Requirements

  • Bachelor’s degree in electrical engineering or equivalent.
  • 8+ years of hands-on experience developing complex SoC or silicon products in server, storage, and/or networking markets.
  • Experience with advanced CMOS nodes of 7nm or smaller.
  • Deep expertise in at least one high-speed protocol such as PCIe, Ethernet, InfiniBand, or DDR.
  • Proficiency with Cadence and/or Synopsys digital design flows and familiarity with UVM-based verification.
  • Experience with silicon bring-up, debug, failure analysis, and cross-functional collaboration.

Nice to have

  • Experience delivering multiple high-performance designs to production in data-center environments.
  • Collaboration with embedded firmware teams and familiarity with RISC-V, Arm, or similar processor subsystems.
  • Contributions to design methodology, CAD automation, or design infrastructure.

Culture & Benefits

  • Collaborative environment involving verification, physical design, DFT, post-silicon, and global teams.
  • Opportunity to work on next-generation high-performance connectivity products.
  • Inclusive workplace encouraging applications from people with diverse backgrounds and experiences.

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