Principal Advanced Packaging Engineer (Optical Chips)

Location: San Jose, California, United States

Salary: $205,000–$260,000 per year, depending on experience, level, and business need. Discretionary bonus, incentives, and benefits may also be available.

Company

hirify.global provides rack-scale AI infrastructure through semiconductor-based connectivity solutions and software for hyperscalers and ecosystem partners.

What you will do

• Lead R&D for advanced packaging of optical chips, including 2.1D, 2.5D, and 3D integration.
• Define and optimize wafer-level, panel-level, and die-level packaging process flows.
• Drive EIC-to-PIC integration and broader optical device integration for NPO and CPO products.
• Select and qualify advanced packaging materials and collaborate with OSATs, tool vendors, and material suppliers.
• Characterize and improve yield, reliability, and process capability.
• Develop and maintain packaging PDKs and design rules.

Requirements

• B.S., M.S., or Ph.D. in Electrical Engineering, Materials Science, Mechanical Engineering, or a related field.
• 8+ years of semiconductor or advanced packaging engineering experience with demonstrated technical leadership.
• Deep expertise in 2.5D/3D integration, flip-chip, hybrid bonding, Cu pillar, TSV, RDL, and overmold processes.
• Experience with silicon photonics chip packaging, EIC/PIC integration, and advanced packaging materials.
• Experience qualifying equipment and processes with OSATs or tool suppliers.
• Experience with PDK development, packaging design rules, yield analysis, reliability characterization, Cpk, and SPC.

Nice to have

• Hands-on CPO or NPO product development experience.
• Experience with optical coupling or waveguide alignment for photonic integration.
• Familiarity with DFM and DFT for advanced packaging.

Culture & Benefits

• Work with hyperscalers and ecosystem partners on next-generation AI infrastructure.
• Discretionary bonus, incentives, and benefits may be available.
• The company encourages applications from candidates with diverse backgrounds and experiences.