Principal 3D-Heterogeneous Integration Engineer (Semiconductor Packaging)

Location: Essex Junction, United States; travel up to 10%

Salary: $85,000–$146,000 per year

Company

hirify.global is a full-service semiconductor foundry providing design, development, and fabrication services with a manufacturing footprint across three continents.

What you will do

• Lead 3D heterogeneous integration process development for advanced packaging product requirements.
• Develop multi-die stacking, die-to-wafer and wafer-to-wafer fine-pitch hybrid bonding, TSV, bump, and wafer-finish integration processes.
• Drive end-to-end process integration and planning for new capabilities and early product prototypes.
• Collaborate with unit-process and manufacturing engineers, tool and material vendors, joint development partners, and OSAT organizations.
• Analyze data, interpret results, identify failure modes, and resolve process integration challenges.
• Generate intellectual property related to novel wafer integration and packaging technologies while mentoring new hires and supporting hiring activities.

Requirements

• Master’s degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or a related field.
• At least 4–5 years of related experience with a master’s degree.
• In-depth knowledge of BEOL processes and integration, advanced bonding, TSVs, bump and wafer-finish integration, wafer test/probe, OSAT collaboration, package development, and assembly.
• Strong problem-solving and technical troubleshooting skills, including design of experiments.
• Overall GPA of at least 3.0 and proven good academic standing.
• Fluent written and verbal English required.

Nice to have

• PhD education level with 2–3 years of related experience.
• Prior leadership experience within an OSAT ecosystem or internally.
• Project management, planning, organizational, and communication skills.

Culture & Benefits

• Work within the Advanced Packaging Lab on cross-functional semiconductor R&D initiatives.
• Support Environmental, Health, Safety & Security requirements and programs.
• Employment is subject to applicable pre-employment conditions and laws.
• Equal-opportunity workplace with commitment to cultural diversity.