Package Roadmap Tool Intern – Package Innovation

Location: Kuala Lumpur, Malaysia

Company

hirify.global develops semiconductor technologies and package innovation solutions.

What you will do

• Design and implement a tool for tracking package technology evolution, capabilities, and platform alignment.
• Integrate inputs from business lines, competitive analysis, and suppliers into a centralized roadmap framework.
• Improve roadmap data structures, usability, automation, dashboards, and visualizations.
• Support roadmap reviews and alignment with package innovation strategy, cost targets, and technology readiness.
• Collaborate with platform, API, and manufacturing teams.
• Gain practical exposure through ATKL manufacturing projects, including package assembly and process flows.

Requirements

• Degree candidate in Computer Science, Engineering, or a related field.
• Strong programming and data-structuring skills, including Python, data tools, or automation frameworks.
• Experience with Excel, Power BI, or similar visualization and tool-development solutions.
• Ability to translate technical inputs into structured, scalable frameworks.
• Self-driven approach with strong collaboration and communication skills.

Culture & Benefits

• Full-time internship in a cross-functional semiconductor and manufacturing environment.
• Collaboration with platform, API, business-line, supplier, and manufacturing stakeholders.
• Practical exposure to package assembly and manufacturing process flows.