Staff Engineer, Packaging Engineering, Structural Simulation

Location: Batu Kawan, Penang, Malaysia; onsite at the Penang SDSM Office

Company

hirify.global develops Flash memory and advanced memory technology products supported by large-scale manufacturing and semiconductor packaging capabilities.

What you will do

• Model and simulate the mechanical responses of IC packages, flash products, and solid-state drives.
• Influence package and product design by addressing structural integrity, reliability, material behavior, and process interactions.
• Design and conduct mechanical experiments, testing, and design-of-experiments activities for feasibility and validation.
• Develop an in-house structural simulation automation platform using commercial software such as ANSYS and Abaqus.
• Collaborate with package and product design, electrical and physical characterization, reliability testing, failure analysis, assembly R&D, and process engineering teams.
• Support development of smaller, thinner, denser, higher-power, and more reliable semiconductor packages.

Requirements

• Ph.D. in Mechanical Engineering with more than 3 years of experience, or M.S. in Mechanical Engineering with more than 5 years of experience.
• Strong background in computational and/or experimental solid mechanics, including failure analysis and design of experiments.
• Knowledge of mechanical behavior of composite laminates, polymers, metals, and solder.
• Experience designing and conducting mechanical testing and/or using commercial finite element analysis software.
• Understanding of semiconductor packaging processes, materials, and technologies, including substrate manufacturing, molding, wire bonding, die attach, and flip chip.
• Experience with semiconductor packaging standards and regulations, strong communication skills, and the ability to work in a global engineering environment.

Nice to have

• In-depth knowledge of IC packaging.
• Knowledge of machine learning and data analytics utilizing AI.

Culture & Benefits

• Full-time exempt employment.
• Inclusive environment focused on diversity, belonging, respect, and contribution.
• Work with global engineering teams across semiconductor packaging and advanced memory technology.