Panel-level Advanced Packaging Process Engineer (PVD)

Location: Hwaseong-Lucestar, South Korea; willingness to work at and travel between the Cheonan and Dongtan sites is required. The role includes on-site customer support and approximately 20% travel.

Company

hirify.global develops materials science, engineering solutions, and equipment used in semiconductor and advanced display manufacturing.

What you will do

• Provide on-site technical support for PVD metal deposition systems, including installation, qualification, troubleshooting, and process stabilization.
• Support and optimize seed, barrier, and RDL-related metal stack deposition for panel-level packaging.
• Design and execute process development activities and DOEs, analyze data statistically, and recommend process improvements.
• Diagnose process and equipment issues involving large-format panels, film uniformity, panel warpage and handling, and edge-to-center metal profile control.
• Collaborate with customers, field teams, R&D, and internal engineering groups to resolve technical and operational issues.
• Mentor junior engineers and support small- to mid-scale technical projects.

Requirements

• Bachelor’s or master’s degree in materials science, chemistry, semiconductor engineering, or a related technical discipline.
• 3–10 years of experience in semiconductor process engineering, equipment support, or advanced packaging.
• Hands-on experience with PVD metallization, including seed, barrier, or metal-stack deposition.
• Knowledge of advanced packaging, FOPLP, chiplet integration, heterogeneous packaging, BEOL, or RDL metallization.
• Strong communication skills for customer-facing technical support, attention to detail, and the ability to work in physically demanding fab environments.
• Proficiency in English is required for technical documentation and global collaboration.

Nice to have

• Experience supporting advanced packaging and metallization in both wafer-level and panel-level manufacturing.
• Prior on-site customer support or field engineering experience.
• Experience with process integration challenges in large-format panel PVD equipment.

Culture & Benefits

• Work with global semiconductor manufacturers on panel-level advanced packaging technologies.
• Technology-driven and innovation-focused work environment.
• Opportunities to develop subject-matter expertise in panel-level packaging, metallization, and PVD processes.
• Supportive environment focused on learning, development, health, and wellbeing.
• Regular employee position with company benefits.