Назад
3 дня назад

Global Supply Chain Manager, OSAT

Формат работы
hybrid
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
Taiwan
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Global Supply Chain Manager, OSAT (AI Hardware/Semiconductors): Managing OSAT partnerships, backend manufacturing execution, and supply continuity for advanced AI hardware from wafer-out through final shipment with an accent on advanced packaging, multi-die products, and high-density substrate sourcing. Focus on coordinating qualification and production ramps, negotiating supplier agreements, and solving yield, capacity, quality, logistics, and schedule risks across Taiwan-based partners.

Location: Hybrid, based in New Taipei City, Taiwan, with regular travel

Company

Builds high-performance AI systems based on innovations across software, compilers, platforms, networking, semiconductors, and RISC-V CPUs.

What you will do

  • Lead OSAT supplier relationships, QBRs, KPI reviews, escalations, and commercial negotiations.
  • Coordinate engineering builds, qualification lots, process readiness, yield ramps, demand, capacity, materials, and production schedules.
  • Manage backend operations including bumping, assembly, burn-in, final test, and system-level test for advanced packaging and multi-die products.
  • Own substrate and critical-material sourcing, including capacity, pricing, tooling, lead-time risk, and high-density substrate requirements for HBM and AI compute products.
  • Resolve supply, quality, yield, logistics, and schedule risks while improving OSAT data, KPIs, analytics, and automation processes.
  • Travel regularly and collaborate with global suppliers and teams across North American and Asia-Pacific time zones.

Requirements

  • 7+ years of experience in semiconductor supply chain, manufacturing, or supplier management.
  • Bachelor’s degree in Supply Chain, Engineering, or a related discipline.
  • Strong understanding of OSAT workflows, including flip-chip, wire bond, and wafer-level packaging.
  • Hands-on experience with Taiwan-based OSAT partners and complex supplier negotiations covering pricing, tooling, and NRE costs.
  • Experience with ERP systems such as SAP or Oracle, PLM systems, and reporting tools such as Tableau or Power BI.
  • Employment is contingent on eligibility to access U.S. export-controlled technology and compliance with applicable U.S. export laws.

Nice to have

  • Mandarin fluency.

Culture & Benefits

  • Collaborative environment focused on curiosity and solving difficult technical problems.
  • Exposure to the full path from wafer fabrication through packaged silicon delivery.
  • Opportunity to manage strategic partnerships with semiconductor manufacturers across Asia.
  • Learning opportunities in advanced packaging, multi-die products, OSAT capacity, yield, quality, cost, and logistics.
  • Level and offer are determined according to experience assessed during the interview process.

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