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2 дня назад

Senior Staff Process Integration Development Engineer (Semiconductor Manufacturing)

155 520 - 298 440$
Формат работы
hybrid
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Senior Staff Process Integration Development Engineer (Semiconductor Manufacturing): Developing data-driven process integration solutions for semiconductor technology and high-volume manufacturing with an accent on variability analysis, process control, and yield improvement. Focus on building analytics infrastructure, detecting process excursions, matching chambers and tools, and applying predictive analytics and machine learning to manufacturing optimization.

Location: Hybrid role with on-site work at an hirify.global site in Phoenix, Arizona, or Hillsboro, Oregon, United States

Annual salary: $155,520–$298,440 USD

Company

hirify.global develops semiconductor technologies and operates technology development and high-volume manufacturing organizations for its own products and foundry customers.

What you will do

  • Lead data-driven identification, prioritization, and resolution of process integration challenges.
  • Perform signal mining, variability analysis, and root-cause investigations.
  • Design and deploy data analytics infrastructure for inline monitoring, process control, and rapid excursion detection.
  • Develop variability tracking and chamber/tool matching methods to reduce systematic process variation.
  • Build automated databases, reporting systems, and analysis workflows for high-volume manufacturing decisions.
  • Support predictive analytics and machine-learning-based process optimization.

Requirements

  • Master’s degree in Electrical Engineering, Physics, Chemistry, Materials Science, or a related STEM field.
  • At least 5 years of semiconductor industry experience focused on process integration development and customization.
  • Experience in large-volume manufacturing environments and a strong understanding of manufacturing processes and platforms.
  • Expertise in device physics and/or interconnects and critical parameter control.
  • Experience using big data analysis to identify and resolve process and manufacturing challenges.
  • Leadership, communication, and technical project delivery skills.

Nice to have

  • Ph.D. in a relevant engineering, science, or STEM discipline.
  • Project or program management and cross-functional team leadership experience.
  • Experience with new semiconductor technology development, FEOL/BEOL optimization, foundry operations, and customer requirements.
  • Experience in yield improvement, high-volume manufacturing optimization, and power-performance strategy.
  • Fabrication process engineering experience in lithography, advanced patterning, dry etch, wet cleaning, diffusion, thin-film deposition, or CMP.

Culture & Benefits

  • Hybrid work model combining on-site and off-site work.
  • Competitive pay and stock bonuses.
  • Health, retirement, and vacation benefits.
  • Cross-functional collaboration across technology development, manufacturing, process engineering, and integration teams.

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