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9 дней назад

Module Engineering PhD Intern (Wet Etch)

120 898 - 120 902$
Формат работы
onsite
Тип работы
fulltime
Грейд
trainee
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Мэтч & Сопровод

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Описание вакансии

Текст:
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TL;DR
Module Engineering PhD Intern (Wet Etch) (Semiconductor Manufacturing): Developing, optimizing, and sustaining wet-etch semiconductor manufacturing processes and equipment with an accent on process stability, yield, quality, and operational efficiency. Focus on analyzing manufacturing data, troubleshooting equipment and process issues, and applying scientific and engineering methods to solve complex challenges in high-volume fabrication.

Location: On-site in Hillsboro, Oregon, United States

Annual salary: $120,898–$120,902 USD

Company

hirify.global Foundry develops, optimizes, and sustains advanced semiconductor manufacturing processes and equipment for hirify.global's technology platforms.

What you will do

  • Support the development, implementation, optimization, and sustainment of wet-etch semiconductor manufacturing processes.
  • Troubleshoot, maintain, and qualify manufacturing equipment to improve process stability, reliability, and performance.
  • Analyze process and equipment data to identify improvement opportunities and drive corrective actions.
  • Collaborate with cross-functional engineering teams on process control, yield, quality, and operational efficiency.
  • Investigate manufacturing issues and present technical findings, recommendations, and project outcomes to engineering stakeholders.

Requirements

  • Currently pursuing a PhD in chemistry, physics, materials science, chemical engineering, electrical engineering, mechanical engineering, or a related discipline.
  • Knowledge of semiconductor manufacturing, materials processing, device fabrication, or related technologies through research, coursework, laboratory work, or industry experience.
  • Experience applying scientific and engineering methods to solve technical problems.
  • Strong analytical, troubleshooting, and problem-solving skills.
  • Ability to work on-site in Hillsboro, Oregon, United States.

Nice to have

  • Cumulative GPA of 3.0 or higher.
  • At least three months of educational, research, laboratory, internship, or industry experience.
  • Experience with data analysis, statistical methods, modeling, simulation, automation, or visualization using Python, MATLAB, SQL, JMP, R, or equivalent tools.
  • Experience using AI and large language models in research, engineering, or productivity workflows.
  • Research, coursework, projects, publications, or internship experience related to semiconductor technology, advanced manufacturing, process development, materials science, device physics, or data analytics.

Culture & Benefits

  • Hands-on exposure to advanced semiconductor manufacturing technologies.
  • Mentorship from experienced engineers and technical leaders.
  • Projects influencing real-world production and technology development.
  • Competitive pay, stock bonuses, health benefits, retirement benefits, and vacation.
  • Opportunities to develop technical, analytical, communication, and leadership skills.

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