Package Design Staff/Sr.Staff Engineer (Semiconductor)

Location: Bangalore, India

Company

hirify.global develops semiconductor solutions and advanced connectivity and compute products for enterprise, cloud, AI, and carrier architectures.

What you will do

• Drive microelectronic package development from concept through tapeout.
• Work with package architects and technical leads to select technologies that meet manufacturability, performance, reliability, and cost requirements.
• Develop C4 and BGA ball maps optimized for signal integrity, power integrity, and layout efficiency.
• Plan and validate netlist mappings across dies, interposers, and substrates, including die placement, padstacks, net assignments, and package connectivity.
• Create and maintain Package Requirement Documents covering die arrangements, stackups, and design constraints.
• Collaborate with chip, board, and electrical simulation teams on package and system co-design.

Requirements

• 5–12 years of related professional experience.
• Experience developing netlists, schematics, C4 ball maps, and BGA ball maps for large, complex, high-pin-count packages.
• Proficiency with Cadence OrbitIO, Integrity System Planner, or equivalent design tools.
• Strong understanding of package design rules, breakout, place and route, signal shielding, reference planes, power distribution, and pinout optimization.
• Knowledge of SI/PI fundamentals, 2D and 2.5D packaging, CoWoS-S/R/L, EMIB, CPO, CPC, thermal and mechanical constraints, foundry design rules, and substrate manufacturing constraints.
• Ability to collaborate across functions and global time zones, with strong communication, presentation, and documentation skills.

Nice to have

• Experience running and interpreting signal and power simulations.
• Experience with tool, process, and flow development, library maintenance, and basic scripting for automation.
• Understanding of package constraints such as warpage and thermal interface materials.

Culture & Benefits

• Participation in bonus and equity plans, including a new-hire equity grant and annual equity refreshers.
• Competitive compensation and benefits.
• Collaborative, transparent, and inclusive work environment.
• Resources and support for professional growth and development.
• Access to technology and software may be subject to U.S. export control regulations and licensing review.

Hiring process

• Interviews assess individual experience, thought process, and communication skills.
• AI tools, transcription applications, automated answer generators, and automated note-taking tools are prohibited during interviews.