Quality and Reliability Engineer (Semiconductor Manufacturing)

Location: Penang, Malaysia; hybrid work model with on-site work at the assigned hirify.global site

Company

hirify.global develops semiconductor technologies and operates packaging, assembly, and manufacturing programs.

What you will do

• Manage manufacturing excursions, chair Material Review Board meetings, drive containment strategies, assess product risks, and disposition discrepant material.
• Provide technical input on solder joint reliability and thermomechanical interactions across wafers, dies, and packages.
• Lead root-cause investigations and systemic corrective actions using 8D methodologies.
• Develop early detection and containment systems, and enhance material disposition requests, eDispo screens, and quality and reliability best practices.
• Support factory operations, material disposition, die inking, technology certification, and production ramp activities.
• Use data extraction tools, scripting, statistics, and machine learning to analyze inline, end-of-line, and reliability data.

Requirements

• Master's degree in Materials Science, Physics, Chemical Engineering, Mechanical Engineering, or a related field with relevant semiconductor manufacturing experience, or a bachelor's degree with at least 5 years of relevant experience.
• Experience in semiconductor manufacturing, C4 bumping, and chip assembly.
• Experience with solder joint reliability, excursion management, and failure mode analysis.
• Proficiency in statistics, data analytics, and data mining for quality and reliability assessments.
• Familiarity with quality and reliability systems and tools, strong communication and meeting skills, and the ability to work across geographies.
• Strong quality and zero-defect mindset, with the ability to drive corrective actions and collaborate with cross-functional teams.

Nice to have

• Influencing skills for promoting a quality-focused mindset across the organization.
• Experience managing impactful Material Review Boards.

Culture & Benefits

• Hybrid work model combining on-site and off-site work.
• Opportunity to contribute to advanced wafer packaging, 3D Foveros, and assembly technologies.
• Collaboration with Foundry, Technology Development, ramp, operations, and customer-facing partners.
• Shift 1 schedule based in Malaysia.