Senior Engineer (Semiconductor Manufacturing)

Location: Seremban, Malaysia

Company

hirify.global operates in semiconductor manufacturing, with this role focused on backend assembly molding processes and equipment.

What you will do

• Develop, characterize, optimize, and sustain molding processes and equipment for semiconductor backend assembly.
• Own molding process performance, yield, equipment stability, and technical issue resolution in high-volume production.
• Support new product introduction, process qualification, and ramp-up into high-volume manufacturing.
• Drive improvements in yield, quality, reliability, UPH, and cost efficiency using structured engineering methods.
• Collaborate with Process, Equipment, Quality Assurance, R&D, NPI, Product Design, and Reliability teams.
• Maintain process documentation, including SOPs, specifications, control plans, FMEAs, and technical reports.

Requirements

• Bachelor’s degree in Engineering or a related technical discipline.
• Solid knowledge of backend assembly molding processes, compound flow, curing behavior, and defect mechanisms.
• Knowledge of molding compound properties, interactions, and material behavior.
• Familiarity with Six Sigma, DOE, SPC, FMEA, 8D, and statistical analysis tools.
• Ability to work effectively in a fast-paced, high-volume manufacturing environment.

Nice to have

• Hands-on experience with molding tooling and Lauffer molding systems.
• BIM line experience.

Culture & Benefits

• Cross-functional collaboration with engineering, quality, research, product, and reliability stakeholders.
• Opportunities to contribute to technology and package roadmaps through benchmarking, studies, and data-driven recommendations.
• Inclusive recruitment and a commitment to diversity and equal opportunity.
• Access to employee resource groups, including Pride Network and local and global women’s groups.