Die Attach & Wire Bond Process Technician (Photonics)

Location: Chon Buri, Thailand; on-site

Company

hirify.global is a well-funded startup developing photonics infrastructure for AI supercomputing, including optical interconnects and scalable photonic engines.

What you will do

• Set up and operate die attach and wire bonding equipment, including recipe loading, tooling changes, and process monitoring.
• Perform epoxy dispensing, die placement, curing, wire bonding, and visual inspection according to approved procedures.
• Support NPI builds, process trials, DOE, qualification runs, and production ramp activities.
• Troubleshoot equipment, perform preventive maintenance, and verify process parameters.
• Conduct or support die shear, wire pull, ball shear, and other process quality checks.
• Record process data, defects, equipment issues, and test results while supporting yield improvement and root-cause analysis.

Requirements

• Experience with semiconductor packaging, optical modules, silicon photonics, or optical transceiver manufacturing.
• Hands-on experience with Au wire bonding, conductive or non-conductive die attach epoxy, and eutectic die bonding.
• Familiarity with die shear, wire pull, ball shear, and visual inspection criteria.
• Basic understanding of SPC, process capability, DOE, and manufacturing process control.
• Experience supporting NPI, engineering builds, qualification lots, or production ramp activities.
• Willingness to support shift work or production ramp activities when required.

Nice to have

• Experience with K&S, Besi, Palomar, Datacon, Nordson, or similar semiconductor assembly equipment.

Culture & Benefits

• Competitive salary based on experience.
• Health insurance and a comprehensive benefits package.
• Professional development opportunities and certification support.
• Access to photonics technology and cloud platforms.
• Collaborative work with engineering, manufacturing, and quality teams.