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4 дня назад

Principal Technology Development Engineer (MEMS)

125 000 - 165 000$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Principal Technology Development Engineer (MEMS): Developing, optimizing, and transferring semiconductor process flows for reliable, manufacturable MEMS and optoelectronics devices with an accent on process integration, device characterization, and fabrication experiments. Focus on designing DOE studies, optimizing DRIE and release etch modules, analyzing test-lot data, and transferring qualified processes into production.

Location: On-site in Bloomington, Minnesota, USA

Salary: $125,000–$165,000 per year

Company

hirify.global is a U.S.-based semiconductor manufacturing partner transitioning from a captive fab to a pure-play foundry, expanding capacity and advanced BCD, wide-bandgap, automotive, defense, and AI data-center technologies.

What you will do

  • Develop, optimize, document, and transfer process flows and macro modules for MEMS and optoelectronics devices.
  • Design experiments, analyze process simulations and test-lot data, and determine process sequences and parameters for target device performance.
  • Work with Process Engineering to develop, characterize, and optimize semiconductor process modules.
  • Support initial test-chip and transfer-lot processing, identify problems, and improve first-pass success.
  • Prepare production-transfer documentation, develop layout rules, and recommend test structures and mask-set layouts.
  • Manage project schedules and mitigation plans while providing regular development updates to external customers.

Requirements

  • Master’s degree in Electrical Engineering, Materials Science, or Physics; a PhD is also relevant.
  • Typically, 5–7 years of experience with a master’s degree or 5+ years with a PhD.
  • Knowledge of semiconductor device physics, process integration, fabrication, device characterization, layout design, and reliability testing.
  • Experience with MEMS fabrication, including DRIE etching, VHF/BOE release etching, and front- and back-side processing.
  • Skills in DOE design, statistical data analysis, problem solving, technical writing, and communication, plus working knowledge of UNIX.
  • Ability to work on-site and handle exposure to hazardous chemicals, high voltages, and high equipment temperatures.

Culture & Benefits

  • Health, dental, vision, disability, and life insurance.
  • 401(k) plan with company match.
  • Paid time off and annual bonus.
  • Tuition reimbursement.
  • Work supporting quality, safety, environmental management, yield management, and cost-containment initiatives.

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