FAB Device Engineer Intern - Summer 2027

Location: Austin, United States — Ed Bluestein office

Company

hirify.global develops scalable, high-quality, cost-competitive semiconductor technologies and supply solutions.

What you will do

• Enhance functional wafer-probe yield.
• Maintain and improve parametric process control.
• Develop semiconductor integration changes to reduce cost or improve device functionality.
• Support integration development and optimization projects.
• Use electrical testing, physical analysis, and statistical data analysis to solve engineering problems.
• Work independently and contribute to team-based project environments.

Requirements

• Must be pursuing an Electrical Engineering degree or another relevant technical degree, such as Chemical Engineering or Materials Science.
• Familiarity with device parametric extraction, MOS and BJT operation, microfabrication, and unit process integration.
• Knowledge of statistical analysis and process-control concepts.
• Familiarity with materials analysis, metrology operation, and related techniques.
• Must be returning to school or graduating at the end of the summer internship term.

Nice to have

• Educational, research, co-op, or internship experience applying solid-state physics, electrical engineering, or electronic materials principles to microelectronics.
• Experience with JMP, PROMIS, SQL, LabView, or bench-probe characterization.

Culture & Benefits

• Full-time summer internship within the Technology & Operations organization.
• Opportunities to work independently and collaboratively on engineering projects.
• Equal opportunity employment and reasonable accommodations for qualified individuals with disabilities.