7 дней назад
Engineer, Equipment (Semiconductor Manufacturing)
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
Engineer, Equipment (Semiconductor Manufacturing): Developing, qualifying, optimizing, and maintaining Die Attach/Clip Attach equipment for semiconductor assembly manufacturing with an accent on equipment reliability, uptime, automation, and capacity expansion. Focus on commissioning new platforms, analyzing equipment performance, improving OEE through maintenance strategies, and solving complex equipment issues through structured root cause analysis.
Location: Cabuyao, Philippines; onsite role
Company
is a semiconductor manufacturer focused on reliable, high-volume production and advanced assembly technologies.
What you will do
- Develop and implement equipment improvements for Die Attach and Clip Attach processes to increase reliability, uptime, productivity, and cost effectiveness.
- Qualify, install, commission, and release new equipment platforms, automation solutions, and manufacturing technologies.
- Lead equipment capability studies, performance evaluations, data analysis, and OEE improvement initiatives.
- Drive preventive, predictive, and corrective maintenance strategies and lead root cause analysis for equipment issues.
- Support NPI, customer product qualifications, sample builds, technology transfers, equipment upgrades, and automation projects.
- Collaborate with suppliers and Manufacturing, Process Engineering, Quality, Facilities, NPI, and R&D teams; prepare technical documentation and support audits.
Requirements
- Bachelor’s degree in Mechanical, Electronics, Electrical, Mechatronics, or a related Engineering discipline.
- At least 4 years of Equipment Engineering experience in semiconductor assembly manufacturing.
- Experience with Die Attach and Clip Attach equipment; exposure to Solder Dispense, Solder Print, and Reflow equipment is advantageous.
- Knowledge of equipment qualification, commissioning, preventive maintenance, reliability improvement, OEE, MTBF, MTTR, and equipment performance monitoring.
- Proficiency in MS Office and statistical tools such as SAS JMP and Minitab.
- Strong analytical, troubleshooting, problem-solving, communication, technical documentation, and presentation skills.
Nice to have
- Basic understanding of PLCs, automation systems, vision systems, and machine control architecture.
- Familiarity with Die Attach and Clip Attach equipment suppliers and platforms.
- Understanding of project management principles and equipment lifecycle management.
Culture & Benefits
- Competitive salary and benefits package.
- Professional development and career growth opportunities.
- Commitment to workplace safety and employee well-being.
- Innovative and dynamic semiconductor manufacturing environment.
- Inclusive workplace with employee resource groups and accessible recruitment practices.
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