10 дней назад
Senior Engineer I-Process
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
Senior Engineer I-Process (QFN/Die Attach/Wirebond): Sustaining and improving semiconductor packaging processes with an accent on QFN packages, Die Attach equipment, ASM Twin Aero wirebonding, and plasma processing. Focus on DOE, SPC, FMEA, control plans, engineering analysis, and line-sustaining decisions.
Location: Philippines - Mphil 3
Company
develops semiconductor technology and operates as a global organization with a 17,000-member workforce.
What you will do
- Sustain and improve semiconductor packaging and assembly processes.
- Work with QFN packages and Die Attach equipment, including AD832i and AD8312 Plus.
- Support ASM Twin Aero wirebonding and plasma processes.
- Apply DOE, SPC, FMEA, control plans, and other engineering tools.
- Perform engineering analysis and make process decisions in collaboration with cross-functional teams.
Requirements
- Engineering degree in any discipline.
- At least 5 years of experience in a related field.
- Knowledge of QFN packages, DOE, SPC, FMEA, control plans, and engineering tools.
- Experience with Die Attach AD832i and AD8312 Plus, ASM Twin Aero wirebonding, plasma processing, and line sustaining.
- Strong engineering analysis, decision-making, communication, and teamwork skills.
Nice to have
- Background in material science and reliability.
- Project management experience.
Culture & Benefits
- Values-based culture focused on trust, empowerment, respect, diversity, and communication.
- Employee development and career growth programs.
- Stable environment within a multi-billion-dollar global organization.
- Travel requirement of 0%–25%.
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