Tooling Development Engineer (Semiconductor Manufacturing)

Location: Cabuyao, Philippines

Company

hirify.global develops and manufactures semiconductor products and supports high-volume manufacturing operations.

What you will do

• Design, develop, and improve Front-of-Line tooling, fixtures, jigs, and mechanical components for semiconductor manufacturing.
• Create, review, and maintain tooling specifications, engineering drawings, and technical documentation.
• Lead tooling qualification, validation, release, implementation, maintenance, refurbishment, and lifecycle management.
• Coordinate with suppliers and cross-functional teams on design reviews, fabrication, trials, and performance evaluations.
• Analyze tooling performance, equipment data, yield trends, and operational metrics to identify improvement opportunities.
• Lead root cause analysis, corrective actions, continuous improvement, new product introductions, technology transfers, and capacity expansion projects.

Requirements

• Bachelor's degree in Mechanical, Manufacturing, Industrial, or Mechatronics Engineering, or a related engineering discipline.
• Experience in tooling engineering, mechanical design, manufacturing engineering, or semiconductor operations.
• Strong knowledge of tool design principles, mechanical systems, and manufacturing processes.
• Proficiency with CAD software such as AutoCAD, SolidWorks, Creo, or equivalent.
• Experience with tooling design, qualification, validation, lifecycle management, engineering drawings, specifications, and technical standards.
• Strong project management, communication, presentation, and cross-functional collaboration skills.

Nice to have

• Semiconductor manufacturing experience.

Culture & Benefits

• Competitive salary and benefits package.
• Professional development and career growth opportunities.
• Commitment to workplace safety and employee well-being.
• Innovative and dynamic manufacturing environment.
• Inclusive workplace with employee resource groups and reasonable adjustments available during recruitment.