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20 часов назад

System Signal Integrity and Power Integrity Engineer Lead (AI Hardware)

220 000 - 250 000$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior/lead
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
System Signal Integrity and Power Integrity Engineer Lead (AI Hardware): Solving complex signal integrity and power integrity challenges for next-generation AI compute systems across silicon, packages, PCBs, flex interconnects, and connectors with an accent on high-speed interfaces, power delivery networks, and electromagnetic analysis. Focus on correlating simulations with hardware, resolving impedance discontinuities and resonances, and driving system-level design fixes.

Location: Sunnyvale, California, United States; on-site

Base salary: $220,000–$250,000+ annually, plus potential bonus and equity.

Company

hirify.global Systems develops large-scale AI compute hardware and high-performance accelerator systems.

What you will do

  • Solve signal integrity and power integrity problems for high-speed AI compute platforms, including chip-to-chip and chip-to-board interfaces.
  • Perform pre-layout and post-layout SI/PI analysis across PCBs, flex circuits, rigid-flex assemblies, connectors, and advanced packages.
  • Lead root-cause analysis of margin shortfalls, impedance discontinuities, coupling, resonances, and simulation-to-hardware mismatches.
  • Analyze power delivery networks using DC and AC simulations, then correlate results with hardware behavior.
  • Define PCB, rigid-flex, and flex stack-ups, materials, and impedance structures to meet performance targets.
  • Collaborate with silicon and package design teams and act as the technical escalation point for complex SI/PI issues.

Requirements

  • Master’s degree in Electrical Engineering.
  • 15+ years of experience in system-level signal integrity and power integrity engineering for high-speed hardware systems.
  • Deep expertise in high-speed serial and parallel interface analysis and debugging.
  • Strong hands-on experience with PCB, rigid-flex, and flex circuit stack-up design and analysis.
  • Proficiency with 2D and 3D electromagnetic simulation tools.
  • Strong knowledge of transmission line theory, microwave engineering, high-speed design, and system-level power delivery network analysis.

Nice to have

  • Experience with large-scale AI or high-performance computing systems.
  • Experience with server hardware, AI accelerators, GPUs, CPUs, TPUs, datacenter systems, or server platforms.

Culture & Benefits

  • Work on an AI platform designed beyond the constraints of GPUs.
  • Opportunities to publish and open-source AI research.
  • Work with a high-performance AI supercomputer platform.
  • Startup vitality combined with job stability.
  • Non-corporate culture focused on individual beliefs, inclusion, learning, growth, and support.

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