Die Sort Module Engineer (Contract) (Semiconductor)

Location: On-site in Kulim, Malaysia

Company

hirify.global's Wafer Packaging Manufacturing group develops factory solutions for semiconductor packaging, high-density modular assembly, computing, and connectivity.

What you will do

• Improve process and equipment performance for the SDx module in high-volume manufacturing.
• Lead continuous improvement for test equipment and module performance, with a focus on new product and technology introduction.
• Define critical process parameters with technology development and partner factories to support product ramps.
• Manage capacity planning, order required collaterals, and qualify tools in line with the product roadmap.
• Guide a small team through factory projects, including tool and equipment installations.
• Troubleshoot NPI, NTI, and HVM escalations and ensure tools are production-ready.

Requirements

• Bachelor's or master's degree in electrical, electronics, mechanical, mechatronics, or materials engineering.
• Experience with die or wafer sort, test programming, and debugging methodologies.
• Knowledge of semiconductor back-end assembly and tool or equipment qualification for test and metrology deployments.
• Basic understanding of statistical process control, statistical data analysis, and structured problem-solving methods.
• Ability to work independently, analyze technical data, and collaborate across functions.

Nice to have

• Expertise in Design of Experiments, Failure Mode and Effects Analysis, and Root Cause Analysis.

Culture & Benefits

• Full-time hirify.global contract employee position.
• On-site work model with Shift 1 in Malaysia.
• Collaborative, innovation-driven environment within a globally recognized semiconductor manufacturing organization.
• Work focused on safety, quality, productivity, cost targets, and technology advancement.