Assembly Die Bond Process Engineer (Semiconductor)

Location: Kuala Lumpur, Malaysia

Company

hirify.global develops semiconductor technologies and operates semiconductor assembly manufacturing.

What you will do

• Develop, qualify, and optimize die bonding processes for semiconductor packages.
• Establish process parameters and operating specifications, and perform process characterization and verification.
• Support new package development, technology transfers, and new product introductions.
• Provide daily engineering support to manufacturing, troubleshoot die bonding issues, and analyze yield losses and process excursions.
• Implement corrective and preventive actions and drive cost reduction, productivity improvement, and waste elimination initiatives.
• Prepare process documentation, engineering and qualification reports, work instructions, specifications, and technical presentations.

Requirements

• Bachelor's or master's degree in a related engineering discipline.
• Experience in semiconductor manufacturing and die bonding.
• Knowledge of process capability, manufacturing yields, reliability qualification, and quality requirements.
• Experience with root cause analysis methods including 8D, Fishbone, 5 Why, and FMEA.
• Ability to work in semiconductor assembly manufacturing in Kuala Lumpur.

Culture & Benefits

• Focus on product quality, process stability, manufacturing efficiency, and cost reduction.
• Participation in continuous improvement initiatives using Lean Manufacturing and Six Sigma methodologies.
• Responsibility for compliance with safety, environmental, quality, and company standards.