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2 дня назад

Forward Deployment Leader (Physics AI)

20 - 45
Формат работы
remote (только Belgium)
Тип работы
fulltime
Грейд
lead
Английский
b2
Страна
US/Belgium
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Текст:
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TL;DR
Forward Deployment Leader (Physics AI): Building and leading a European team that drives adoption of physics-based AI software for semiconductor and hardware design with an accent on thermal management, simulation workflows, and enterprise customer enablement. Focus on guiding complex thermal analyses, scaling technical field execution, and translating customer feedback into product improvements.

Location: Remote, Brussels/Leuven, Belgium; moderate travel within continental Europe and infrequent travel to Palo Alto, USA

Compensation: €20–€45 based on experience

Company

hirify.global is building physics AI software that helps hardware designers and physics simulation engineers analyze and optimize complex hardware systems, including next-generation semiconductors.

What you will do

  • Build, lead, and scale a high-performing European team of thermal engineers, including hiring, mentoring, and setting technical direction.
  • Partner with Sales to lead technical discussions, scope proof-of-concept evaluations, and deliver product demonstrations to enterprise customers.
  • Guide customer engineering teams through simulation setup, complex test cases, result interpretation, onboarding, deployment, and troubleshooting.
  • Advise customers on thermal management systems, fluid flow, heat dissipation, thermal risk, component reliability, power density, and cooling efficiency.
  • Translate customer feedback, pain points, and workflow bottlenecks into product and engineering improvements.
  • Represent hirify.global at industry conferences and semiconductor events while tracking competitive technologies and market trends.

Requirements

  • Degree in Mechanical Engineering, Electrical Engineering, or a closely related technical field.
  • Expert-level experience with commercial simulation software such as Flotherm, Ansys Icepak/Fluent, or Simcenter STAR-CCM+, plus 15+ years of thermal management and cooling experience.
  • Deep familiarity with semiconductor electronics packaging, advanced 2.5D/3D IC packaging, or foundry ecosystems.
  • Customer-facing experience with strong engineering relationship-management and communication skills.
  • Practical Python or C++ experience for workflow automation or simulation-data parsing.
  • Previous managerial or technical leadership experience with the ability to scale and mentor engineering teams.

Nice to have

  • Experience with structural mechanical simulations, FEA/stress, or electrical signal integrity and power integrity workflows.
  • Experience commercializing EDA or CAE simulation tools for semiconductor and electronics enterprises.
  • Technical pre-sales, application engineering, field applications engineering, or strategic technical sales experience.
  • Experience with AI-assisted design or simulation tools and next-generation physics-based workflows.

Culture & Benefits

  • Remote work with collaboration across Sales, Product, and Engineering.
  • Moderate travel primarily within continental Europe, with infrequent intercontinental travel.
  • Work at the intersection of AI models, fundamental physics, and hardware engineering.
  • Fast-moving startup environment with engineers and researchers.

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