Process Integration Engineer (3D NAND)

Location: Rancho Cordova, California, United States

Salary: $126,960–$223,300 per year

Company

hirify.global is a global memory technology company developing NAND technologies and data storage solutions, with headquarters and facilities in the United States and an international presence across Asia, Europe, and the Americas.

What you will do

• Define process flows and target specifications for customer product requirements.
• Lead multidisciplinary teams through product qualification and manufacturing transfer.
• Identify and resolve process-related issues using model-based problem-solving techniques.
• Apply statistical tools to support data-driven decisions and improve performance, reliability, and yield.
• Drive cost-effective continuous improvement initiatives for semiconductor manufacturing processes.
• Collaborate with device, product engineering, design, manufacturing, reliability, and quality assurance teams to transfer technologies into high-volume production.

Requirements

• MS or PhD in Electrical Engineering, Material Science, or a relevant field.
• 10+ years of experience in semiconductor process engineering.
• Broad and deep knowledge of semiconductor processing techniques and device physics.
• Strong analytical, problem-solving, communication, time-management, and attention-to-detail skills.
• Experience leading multidisciplinary teams and managing multiple projects.
• Ability to work collaboratively and independently while adapting to new technologies and methodologies.

Culture & Benefits

• Collaborative, inclusive, diverse, and results-driven work environment.
• Opportunity to contribute to next-generation memory technology and high-capacity data storage products.
• Work within an established technology company with an entrepreneurial and start-up-oriented mindset.