Silicon Hardware Engineering - Intern, Bachelor’s (Semiconductor)

Location: On-site in the United States, with primary location in Hillsboro, Oregon, and additional locations in Phoenix, Arizona; Folsom and Santa Clara, California; and Austin, Texas. This position is not available in Colorado.

Annual salary range: $91,198–$91,202 USD for the hourly role.

Company

hirify.global develops processors, GPUs, SoCs, photonics, semiconductor manufacturing technologies, and computing platforms.

What you will do

• Contribute to silicon architecture, circuit design, logic, layout, physical design, verification, validation, and debugging.
• Design, build, test, and analyze technologies used in hirify.global processors and platforms.
• Apply scripting, data analysis, automation, modeling, simulation, and hardware validation methods to solve technical problems.
• Collaborate with silicon, product, and manufacturing teams.
• Support innovations in processors, GPUs, SoCs, photonics, and validation systems.

Requirements

• Currently pursuing a bachelor's degree in Computer Engineering, Computer Science, Electrical Engineering, Physics, or a related STEM field.
• At least 3 months of relevant technical experience through coursework, academic projects, research, internships, co-ops, student organizations, assistantships, or similar activities.
• Strong problem-solving, communication, and collaboration skills, with the ability to work in team-based environments.
• Available to start in Spring or Summer 2027.
• Employment-based visa or immigration sponsorship is not available for this position.

Nice to have

• GPA of 3.0 or higher.
• Experience or interest in design, architecture, programming, scripting, data analysis, automation, modeling, simulation, validation, or debugging.
• Hands-on coursework, research, project, or internship experience related to the role family.

Culture & Benefits

• Hands-on work alongside experienced engineers and technical leaders.
• Exposure to the full technology lifecycle, from research and design through semiconductor manufacturing and deployment.
• Compensation may include pay, stock bonuses, health benefits, retirement benefits, and vacation.
• Relocation assistance may be available depending on eligibility, current location, and role specifics.

Hiring process

• Applications are considered for Spring and Summer 2027 internship starts, including potential year-long internship or co-op opportunities.
• Specific compensation details for the preferred location and role are shared during the hiring process.