Platform Hardware and Systems Engineering - Intern, Graduate (Semiconductor)

Location: Hybrid work in the United States, with on-site work at an assigned hirify.global site; primary location Hillsboro, Oregon, with additional locations in Phoenix, Arizona; Folsom and Santa Clara, California; and Austin, Texas. Not available in Colorado.

Annual salary range: $105,698–$105,702 USD.

Company

hirify.global develops computing technologies spanning hardware, software, semiconductor manufacturing, AI-powered innovations, research, design, and global deployment.

What you will do

• Contribute to hardware and systems architecture, design, and integration.
• Perform platform validation, debugging, and performance optimization.
• Work on power, thermal, and signal integrity engineering.
• Develop programming, scripting, automation, and AI-enabled solutions.
• Collaborate cross-functionally to advance platform capabilities.

Requirements

• Currently pursuing a Master’s degree or PhD in computer engineering, computer science, data science, electrical engineering, chemical engineering, mechanical engineering, materials science, chemistry, mathematics, physics, or a related STEM field.
• At least 3 months of relevant technical experience through coursework, academic projects, research, internships, co-ops, student organizations, assistantships, or similar activities.
• Strong problem-solving, communication, and collaboration skills.
• Ability to work effectively in team-based environments.
• Available to start in Spring or Summer 2027, with consideration for year-long internships or co-op opportunities.
• Employment-based visa or immigration sponsorship is not available for this position.

Nice to have

• GPA of 3.0 or higher.
• Experience or interest in design, architecture, programming, scripting, data analysis, automation, modeling, simulation, validation, or debugging.
• Hands-on coursework, research, project, or internship experience related to the role family.

Culture & Benefits

• Hybrid work model combining on-site and off-site work.
• Hands-on projects alongside experienced engineers and technical leaders.
• Competitive compensation with stock bonuses.
• Health, retirement, and vacation benefits.
• Exposure to the full technology lifecycle, from research and design through semiconductor manufacturing and deployment.