MTS/Principal Process Module Engineer (Advanced Packaging)

Location: Singapore; onsite process and equipment work in a 300mm Advanced Packaging Center

Company

Leading semiconductor manufacturer delivering power-efficient and high-performance solutions for growth markets through manufacturing operations across the U.S., Europe, and Asia.

What you will do

• Develop and optimize advanced-packaging unit processes, including bond and debond, pre-bond plasma/UV/cleaning, die re-constitution, annealing, and TSV processes.
• Design, execute, and analyze experiments for multi-stack bond-wafer and die-to-wafer processing.
• Start up and qualify new processes and equipment, supporting equipment acceptance and tool matching.
• Improve process robustness, stability, yield, cost, productivity, and capability for high-volume manufacturing using DOE, statistical tools, SPC, lean manufacturing, and Six Sigma.
• Troubleshoot complex process, equipment, module, and yield issues while supporting integration, quality, qualification, and reliability requirements.
• Coach engineers, lead continuous-improvement programs, and coordinate cross-module process-development projects.

Requirements

• BS, MSc, or PhD in Electrical Engineering, Materials Science and Engineering, Chemical Engineering, Physics, or a related engineering discipline.
• At least 4 years of advanced-packaging experience with a PhD, 6 years with an MSc, or 8 years with a BSc.
• Experience leading fab-wide, cross-module process development and project coordination.
• Hands-on experience with advanced-packaging process tools for Si interposer, die-to-wafer, or wafer-to-wafer processes.
• Excellent verbal and written communication skills and strong interpersonal skills for working across different cultures.
• Manufacturing and process-development experience, including responsibility for group development and operational needs.

Culture & Benefits

• Work in a multicultural and inclusive environment.
• Support environmental, health, safety, and security requirements and programs.
• Employment is subject to applicable local laws, background checks, and medical screenings where applicable.
• No recruitment fees are charged at any stage of the hiring process.