16 минут назад
Semiconductor Packaging Engineering Intern (Semiconductor Manufacturing)
108 000 - 126 000$
Мэтч & Сопровод
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Описание вакансии
Текст:
TL;DR
Semiconductor Packaging Engineering Intern (Semiconductor Manufacturing): Designing and iterating machines and subsystems for semiconductor packaging fabrication with an accent on mechanical prototyping, system integration, and hands-on package and wafer processing. Focus on developing laser ablation, reflow, and automated metal plating equipment, aligning optical and electrical components, and analyzing fabrication data.
Location: Austin, TX — on-site
Compensation: $108,000–$126,000 annualized, paid hourly, plus a housing stipend.
Company
is an early-stage hardware startup developing the hardware, software, fabrication equipment, and components needed to make semiconductor chips.
What you will do
- Design and iterate machines and subsystems for semiconductor packaging fabrication, including laser ablation machines, reflow ovens, and automated metal plating facilities.
- Integrate mechanical, electrical, and optical components, including wiring, optics alignment, and electronics.
- Collaborate with cross-functional teams to improve fabrication processes and equipment.
- Perform hands-on package and wafer processing using 3D printing, metal plating, lithography, and metrology.
- Conduct mechanical prototyping, experiment design, and data analysis for new packaging technologies.
Requirements
- Pursuing a bachelor's degree or higher in engineering.
- At least 1–2 hands-on wet-lab or lab-adjacent experiences, ideally involving metal plating or device fabrication.
- Strong foundation in mechanical engineering, including SolidWorks or Onshape and materials selection.
- Hands-on prototyping experience and the ability to move quickly through design cycles.
- A portfolio showing built projects or systems is required to apply.
Nice to have
- Experience designing mechatronic or electromechanical systems.
- Familiarity with lasering and stereolithography 3D printing.
- Experience with reliability testing, soldering, and reflow testing.
- Experience with nanofabrication and metrology tools, including etching, deposition, patterning, SEM, thin-film measurement, and X-ray tools.
Culture & Benefits
- Preferred internship commitment of 4–8 months, beginning in January.
- Hands-on access to fabrication and engineering tools with training provided.
- Housing stipend, daily lunches, dinners three times per week, and a stocked office kitchen.
- Weekly learning and development opportunities.
- Commuter benefits, including parking and late-night Uber rides from the office.
- Paid time off, medical, dental, vision, life and disability insurance, 401(k), and visa sponsorship.
Hiring process
- Applications must include a portfolio demonstrating completed projects or systems.
- Any offer is contingent on the applicant's ability to comply with U.S. export controls.
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