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16 минут назад

Semiconductor Packaging Engineering Intern (Semiconductor Manufacturing)

108 000 - 126 000$
Формат работы
onsite
Тип работы
fulltime
Грейд
trainee
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

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TL;DR
Semiconductor Packaging Engineering Intern (Semiconductor Manufacturing): Designing and iterating machines and subsystems for semiconductor packaging fabrication with an accent on mechanical prototyping, system integration, and hands-on package and wafer processing. Focus on developing laser ablation, reflow, and automated metal plating equipment, aligning optical and electrical components, and analyzing fabrication data.

Location: Austin, TX — on-site

Compensation: $108,000–$126,000 annualized, paid hourly, plus a housing stipend.

Company

hirify.global is an early-stage hardware startup developing the hardware, software, fabrication equipment, and components needed to make semiconductor chips.

What you will do

  • Design and iterate machines and subsystems for semiconductor packaging fabrication, including laser ablation machines, reflow ovens, and automated metal plating facilities.
  • Integrate mechanical, electrical, and optical components, including wiring, optics alignment, and electronics.
  • Collaborate with cross-functional teams to improve fabrication processes and equipment.
  • Perform hands-on package and wafer processing using 3D printing, metal plating, lithography, and metrology.
  • Conduct mechanical prototyping, experiment design, and data analysis for new packaging technologies.

Requirements

  • Pursuing a bachelor's degree or higher in engineering.
  • At least 1–2 hands-on wet-lab or lab-adjacent experiences, ideally involving metal plating or device fabrication.
  • Strong foundation in mechanical engineering, including SolidWorks or Onshape and materials selection.
  • Hands-on prototyping experience and the ability to move quickly through design cycles.
  • A portfolio showing built projects or systems is required to apply.

Nice to have

  • Experience designing mechatronic or electromechanical systems.
  • Familiarity with lasering and stereolithography 3D printing.
  • Experience with reliability testing, soldering, and reflow testing.
  • Experience with nanofabrication and metrology tools, including etching, deposition, patterning, SEM, thin-film measurement, and X-ray tools.

Culture & Benefits

  • Preferred internship commitment of 4–8 months, beginning in January.
  • Hands-on access to fabrication and engineering tools with training provided.
  • Housing stipend, daily lunches, dinners three times per week, and a stocked office kitchen.
  • Weekly learning and development opportunities.
  • Commuter benefits, including parking and late-night Uber rides from the office.
  • Paid time off, medical, dental, vision, life and disability insurance, 401(k), and visa sponsorship.

Hiring process

  • Applications must include a portfolio demonstrating completed projects or systems.
  • Any offer is contingent on the applicant's ability to comply with U.S. export controls.

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