NPI Process Development Engineer (Automotive Semiconductor)

Location: Kuala Lumpur, Malaysia

Company

hirify.global develops semiconductor solutions for automotive applications.

What you will do

• Develop and qualify new LQFP and BGA packages for total assembly processes in automotive applications.
• Drive quality, yield, cost, and process improvement activities.
• Create and maintain process documentation, process specifications, standard work instructions, OCAP, and QIT documentation.
• Collaborate with cross-functional teams to resolve conflicts and make timely decisions that manage organizational, customer, and project risks.
• Own key projects and align their scope and direction with upper management.

Requirements

• 3–6 years of work experience in semiconductor assembly for automotive customers.
• Hands-on experience with process characterization for laser dicing, plasma dicing, mechanical sawing, die bonding, wire bonding, molding, ball attach, marking, and singulation.
• Good SPC, process control, statistical analysis, and problem-solving skills.
• Strong interpersonal and leadership skills, with a self-driven and results-oriented approach.
• Proficiency with Microsoft PowerPoint, Excel Macro, and Word.

Nice to have

• Experience developing LQFP, MAPBGA, SiP, FCCSP, or FCBGA packages.
• Project management knowledge.

Culture & Benefits

• Cross-functional collaboration is required to support package development and process improvement.
• Close cooperation with upper management on key project scope and direction.