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2 дня назад

Power Integrity Engineer (PCB/ASIC)

200 000 - 300 000$
Тип работы
fulltime
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Power Integrity Engineer (PCB/ASIC): Developing and validating high-performance PCB and package designs for advanced ASIC platforms with an accent on signal integrity, power integrity, and high-speed SERDES channels. Focus on modeling 28+ Gbps interfaces, analyzing 500+ amp power-delivery networks, automating simulation workflows, and translating measurements into robust, manufacturable designs.

Location: Austin, TX; Boulder, Colorado; Chicago, Illinois; or New York, NY, United States

Base salary: $200,000–$300,000 USD per year, plus discretionary performance-based bonuses and benefits.

Company

hirify.global applies a scientific approach to algorithmic trading and operates a sophisticated computing environment for research and development.

What you will do

  • Develop signal integrity and power integrity solutions for complex high-performance electronic systems.
  • Analyze and guide high-speed PCB, BGA, and advanced package designs supporting 28+ Gbps and newer signaling technologies.
  • Simulate, model, optimize, and validate SERDES links, vias, connectors, sockets, stackups, routing, and package interfaces using 3D electromagnetic and circuit-simulation tools.
  • Drive substrate and board-layout guidelines, post-layout extraction, model improvement, and correlation with laboratory measurements.
  • Analyze ASIC power delivery exceeding 500 amps across PSUs, cables, connectors, regulators, PCBs, capacitors, packages, and dies.
  • Automate simulation, data collection, analysis, and visualization while coordinating with internal teams and external design and layout partners.

Requirements

  • MS or PhD in Electrical Engineering, Computer Engineering, Physics, or a related field, or equivalent practical experience.
  • Experience with signal integrity, power integrity, or both in high-performance electronic systems.
  • Strong fundamentals in electromagnetics, transmission lines, and PCB or package design.
  • Experience with high-speed SERDES links at 28+ Gbps and high-current ASIC power-supply design exceeding 500 amps.
  • Proficiency with SI/PI CAE and circuit-simulation tools, such as HFSS, SIwave, Clarity 3D, Sigrity, ADS, SPICE, SIMPLIS, or MATLAB.
  • Python programming or scripting experience and the ability to translate analysis into robust, manufacturable designs.

Nice to have

  • Experience with PAM4 at 56/112+ Gbps.
  • Experience with 2.5D packages, board/package layout, or power-delivery-network evaluation.
  • Familiarity with VNAs, TDRs, and high-speed oscilloscopes.

Culture & Benefits

  • Scientific, technically advanced environment focused on automation and innovation.
  • Cross-functional collaboration across hardware, electrical, mechanical, package, layout, manufacturing, and validation disciplines.
  • Open and transparent workplace that values ideas from new hires and experienced employees.
  • Competitive benefits package and eligibility for discretionary performance-based bonuses.
  • Diverse international organization with a culture of collaboration and togetherness.

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