Principal Package Competence Engineer (Semiconductor Packaging)

Location: Manchester, United Kingdom; hybrid working policy

Company

hirify.global develops semiconductor technologies, including Power MOSFET products and advanced packaging solutions.

What you will do

• Lead package design studies and development activities for new and existing semiconductor products.
• Provide technical leadership and subject-matter expertise in semiconductor packaging, assembly technologies, and industrialization.
• Evaluate emerging package and process technologies and support validation through simulation and technical studies.
• Develop package strategies and long-term technology roadmaps in collaboration with product lines, R&D teams, and assembly sites.
• Lead technical projects covering package development, qualification, process freezes, and high-profile strategic initiatives.
• Mentor junior engineers, support cross-functional stakeholders, and generate innovative and patentable package concepts.

Requirements

• PhD with 5+ years of industry experience, or a Bachelor's/Master's degree with 8+ years of relevant semiconductor experience.
• Extensive experience in semiconductor packaging, assembly technologies, power semiconductor technologies, and applications.
• Proven experience in package innovation, technology development, patent generation, and support for global manufacturing and assembly organizations.
• Strong knowledge of package materials, assembly processes, reliability requirements, failure analysis, reliability testing, and root-cause investigations.
• Expertise in design of experiments, data analysis, technical problem-solving, and advanced package design and simulation tools.
• Technical leadership, documentation, presentation, customer-facing, and stakeholder-influence skills.

Culture & Benefits

• Competitive base salary, annual incentive plan, contributory pension scheme, recognition rewards, income protection, and 12× salary life assurance.
• Visa sponsorship and relocation assistance are available where applicable.
• 33 days of annual leave including bank holidays, flexible benefits, enhanced sick pay, and an on-site medical centre.
• Subsidised canteen, employee assistance programme, retail and entertainment discounts, and sports and social clubs.
• Funded academic support up to PhD level, development plans, global growth opportunities, and work with cutting-edge technologies.
• Commitment to carbon neutrality by 2035, charitable-work leave, and diversity and inclusion initiatives.