Technology Development Quality & Reliability Engineer (Semiconductor Packaging)

Location: Shanghai, China — onsite at the hirify.global Minhang Office

Company

hirify.global develops Flash memory and advanced memory technology solutions supported by global manufacturing capabilities and supply-chain operations.

What you will do

• Define, develop, and qualify new semiconductor packages while maintaining the quality of existing packages.
• Represent Package Engineering in cross-functional teams and ensure packages meet electrical, performance, reliability, and quality requirements before production introduction.
• Own product DPPM and quality and reliability activities for technology development, NAND, and ASIC programs.
• Develop a quality guidance library covering engineering criteria, statistical Design of Experiments, scorecards, sampling plans, and measurement methodologies.
• Resolve technology and product development quality cases using DMAIC, root-cause analysis, and 8D methodologies.
• Coordinate worldwide factory introductions of new packages and assembly processes, including assembly yield improvement and package cost reduction programs.

Requirements

• Master’s degree in Mechanical Engineering or Materials Engineering.
• Knowledge of semiconductor packaging.
• Experience or working knowledge of semiconductor packaging projects covering mechanical and electrical integrity.
• Working knowledge of AutoCAD, Cadence APD, Finite Element Analysis, Design of Experiments, statistical techniques, and package failure analysis.
• Ability to manage multiple tasks, meet tight deadlines, and communicate effectively with cross-functional stakeholders.

Culture & Benefits

• Work in a global semiconductor manufacturing environment with factories worldwide.
• Contribute to advanced Flash memory and packaging technology development.
• Focus on innovation, product quality, manufacturing performance, and reliability.