Engineer II, Product Test Engineering (CMP)

Location: Zhudong, Hsinchu County, Taiwan

Company

Supports semiconductor manufacturing, process development, and next-generation CMP technology optimization.

What you will do

• Plan and execute CMP process experiments and wafer characterization activities.
• Operate CMP polishing and metrology equipment safely and efficiently.
• Analyze test data, prepare technical reports, and communicate findings with engineering teams.
• Troubleshoot process and equipment issues to improve performance and repeatability.
• Support process development, optimization, and feasibility studies.
• Collaborate with engineers, scientists, and cross-functional teams on technology development projects.

Requirements

• Bachelor’s degree in engineering, chemistry, or a related field.
• At least 2 years of experience in semiconductor manufacturing, CMP processes, wafer fabrication, or cleanroom environments.
• Ability to work independently in a fast-paced environment and collaborate with global engineering teams.
• Strong communication, critical-thinking, and problem-solving skills.
• Proficiency in Microsoft Word, Excel, and PowerPoint.
• Ability to maintain accurate documentation and comply with EHS and quality standards.

Nice to have

• Experience with JMP, Minitab, or SAS.
• Hands-on knowledge of CMP processes.
• Familiarity with defectivity and wafer-thickness metrology.

Culture & Benefits

• Participation in cleanroom continuous-improvement and safety initiatives.
• Independent ownership of projects with clear goals, milestones, and deliverables.
• Focus on operational excellence, safety, quality, and preventing recurring issues.