7 дней назад
Assoc Eng Equipment Engineering (Metrology)
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
Assoc Eng Equipment Engineering (Metrology) (Semiconductor Manufacturing): Supporting backgrind and dicing wafer manufacturing processes in Singapore with an accent on equipment operation, process control, inspections, and defect reduction. Focus on performing thickness measurements, entering SPC data, carrying out preventive maintenance, and troubleshooting process issues during 12-hour rotating shifts.
Location: Singapore; 12-hour rotating shifts required
Company
is a full-service semiconductor foundry providing design, development, and fabrication services with manufacturing operations across three continents.
What you will do
- Support daily backgrinding and dicing operations.
- Perform incoming and outgoing inspections, laminating, taping and detaping according to process requirements.
- Conduct thickness measurements and enter production data into SiView.
- Carry out equipment preventive maintenance according to the planned schedule.
- Enter statistical process control data for defined critical equipment parameters.
- Work with process and equipment engineers, product or lot owners, and cross-functional teams to troubleshoot issues and improve processes.
Requirements
- Diploma or ITE Hi-Nitec qualification in electrical, electronic, or mechanical engineering.
- At least 2 years of experience in an electronic production environment, preferably in OSAT or assembly.
- Hands-on experience with backgrind or dicing processes.
- Ability to work 12-hour rotating shifts.
- MS Office literacy and knowledge of SPC.
- Ability to follow environmental, health, safety, and security requirements.
Culture & Benefits
- Multicultural and inclusive workplace focused on respect, diversity, and collaboration.
- Employment is subject to applicable background checks, medical screenings, and local laws.
- Equal employment opportunity is provided regardless of legally protected characteristics.
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