Assoc Eng Equipment Engineering (Backgrind & Dicing)

Location: Singapore; onsite work on a 12-hour rotating shift

Company

hirify.global is a semiconductor foundry providing design, development, and fabrication services through a global manufacturing footprint.

What you will do

• Support daily backgrind and dicing production runs.
• Perform incoming and outgoing inspections, laminating, taping and detaping according to process requirements.
• Carry out backgrinding, dicing, and wafer thickness measurements.
• Enter thickness and SPC data into SiView and monitor defined equipment parameters.
• Perform planned equipment preventive maintenance and troubleshoot process or equipment issues with cross-functional teams.
• Follow environmental, health, safety, security, and quality requirements.

Requirements

• Diploma or ITE Hi-Nitec qualification in Electrical, Electronic, or Mechanical Engineering.
• At least 2 years of experience in an electronic production environment, preferably in OSAT or assembly.
• Hands-on experience with backgrind or dicing processes.
• Ability to work a 12-hour rotating shift in Singapore.
• MS Office literacy and knowledge of statistical process control.

Culture & Benefits

• Work in a multicultural and inclusive manufacturing organization.
• Equal employment opportunity regardless of age, ethnicity, citizenship, religion, gender, sexual orientation, or physical abilities.
• Employment offers are subject to background checks, applicable medical screenings, and local laws.
• Benefits are provided according to the applicable hirify.global program.