Thermal Process Engineer (Liquid Cooling)

Location: Bac Ninh, Vietnam, Industrial Park; onsite role

Company

hirify.global is a high-growth startup developing high-performance switching systems for hyperscale and AI data centers.

What you will do

• Define and scale manufacturing processes for direct-to-chip cold plates, manifolds, tubing, hoses, quick-disconnects, and thermal interface materials.
• Develop process flow diagrams, control plans, work instructions, and manufacturability requirements.
• Lead NPI execution from EVT through DVT, PVT, and mass production, including validation builds and golden-line definition.
• Specify and qualify torque tools, TIM and sealant dispensing systems, pressure and leak-test equipment, and assembly automation.
• Define acceptance criteria for leak rate, pressure decay, flow resistance, and thermal performance.
• Partner with engineering, ODMs, suppliers, and manufacturing teams on reliability, root-cause analysis, yield improvement, and cost reduction.

Requirements

• Master’s degree in Mechanical Engineering, Manufacturing Engineering, or a related field.
• 7+ years of manufacturing and process engineering experience, including 2+ years working with liquid cooling.
• Hands-on experience with thermal or fluid-handling hardware and liquid-cooled servers, network switches, or HPC systems.
• Strong knowledge of mechanical tolerances, torque control, assembly tooling, manufacturing quality systems, thermodynamics, and heat transfer.
• Experience working in or with startups and operating in fast-paced NPI and production-ramp environments.

Nice to have

• Knowledge of cold-plate materials and finishes, including copper, aluminum, and nickel plating.
• Experience with TIM characterization and dispensing.
• Familiarity with helium mass spectrometry and pressure-decay leak detection.
• Experience with hyperscalers, large ODMs, or data-center cooling architectures such as DLC and CDU systems.

Culture & Benefits

• Work on next-generation AI and hyperscale networking infrastructure.
• Collaborate across thermal design, mechanical design, manufacturing engineering, reliability, quality, and supply chain.
• Drive automation, process control, and data-based improvements in a high-growth startup environment.
• Contribute to systems designed for high-density compute environments exceeding 50–100 kW per rack.