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Mechanical Engineer (AI Infrastructure)

Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Mechanical Engineer (AI Infrastructure): Designing and delivering chassis, line cards, and electro-mechanical systems for high-capacity networking products used in AI infrastructures, with an accent on tolerance analysis, CAD modeling, connector integration, and manufacturing processes. Focus on developing liquid- and force-cooled systems, resolving cross-functional technical tradeoffs, meeting EIA, ETSI, OCP, MSA, and NEBS requirements, and validating prototypes.

Location: Santa Clara, California, United States

Company

Designs high-capacity networking systems for AI infrastructures, advanced data centers, and telecom environments.

What you will do

  • Design and deliver chassis, line cards, and complex electro-mechanical assemblies for reliable and scalable networking products.
  • Perform 2D and 3D tolerance analyses, tolerance loops, and design validation.
  • Develop mechanical solutions using sheet metal, injection-molded plastic, die casting, and extrusion while meeting EMI, safety, and compliance requirements.
  • Create CAD models, board outline drawings, PCB layout constraints, part and assembly drawings, BOMs, part numbers, and ECOs using Creo with Windchill or SolidWorks.
  • Design connector, cable harness, and cooling solutions, including OSFP, QSFP-DD, OSFP-XD, orthogonal backplanes, liquid cooling, and force cooling.
  • Collaborate with hardware, signal integrity, CAD, thermal, manufacturing, PCB, PLM teams, suppliers, and testing labs; build mock-ups, perform rework, test prototypes, and support compliance validation.

Requirements

  • Bachelor’s or higher degree in Mechanical Engineering.
  • 5+ years of mechanical design experience in telecom or data center product development.
  • Proficiency in SolidWorks and Creo.
  • Strong knowledge of EIA, ETSI, and OCP rack standards.
  • Experience with OSFP, QSFP-DD, and OSFP-XD connectors and orthogonal backplane systems.
  • Expertise in tolerancing and tolerance loops for electro-mechanical assemblies.
  • Experience designing sheet metal, injection-molded, die-cast, and extruded components.
  • Experience with cable harnesses, liquid-cooled and force-cooled systems, and tools for rework and mock-up creation.
  • Strong collaboration, communication, problem-solving, adaptability, and technical risk and tradeoff management skills.

Nice to have

  • Experience with Creo cabling extensions.
  • Familiarity with NEBS testing and compliance.
  • Experience generating silkscreens and overlays with Illustrator.

Culture & Benefits

  • Work on AI infrastructure, networking, and data center technologies.
  • Collaborate with experts across hardware, thermal, manufacturing, PCB, PLM, and related disciplines.
  • Contribute to industry-defining projects in a fast-paced and innovative environment.

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