Senior Packaging Materials R&D Engineer (Semiconductor Packaging)

Location: Chengdu, China

Company

hirify.global develops integrated power semiconductors and systems power delivery architectures, with a focus on innovation and sustainability.

What you will do

• Lead research and development of epoxy die-attach adhesives, molding compounds, underfill materials, and other packaging polymers.
• Define material specifications, thermal, mechanical, electrical, and reliability performance targets, and qualification plans.
• Analyze material properties, failure mechanisms, and compatibility with semiconductor packaging processes.
• Collaborate with material suppliers, process engineering, and reliability teams to optimize formulations and performance.
• Evaluate and onboard domestic second-source material suppliers through characterization, comparative testing, and process-window evaluation.
• Manage qualification from initial samples through production release while meeting quality, reliability, and cost requirements.

Requirements

• Master’s or PhD degree in Materials Science, Chemical Engineering, Polymer Science, Chemistry, or a closely related field.
• 5+ years of related experience.
• Deep expertise in chemistry, formulation, processing, and failure modes of packaging polymers.
• Experience with material characterization techniques such as TGA, DMA, and rheology.
• Experience with reliability testing including MSL, TCT, and HAST.

Culture & Benefits

• Work in a semiconductor product company focused on integrated power semiconductors and advanced packaging.
• Contribute to leading-edge products, technical innovation, and supply-chain resilience.
• Join an environment that emphasizes creativity, sustainability, and diversity.