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обновлено 8 дней назад

Sr Staff / Principal CAD & Design Methodology Engineer (RTL-to-GDSII)

Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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TL;DR
Sr Staff / Principal CAD & Design Methodology Engineer (RTL-to-GDSII): Architecting multi-vendor, multi-foundry RTL-to-GDSII platforms and hierarchical SoC implementation flows for advanced-node, low-power chiplet products with an accent on EDA integration, power methodology, clocking, and physical design. Focus on defining UPF/CPF flows, EM/IR and STA methodology, floorplanning, timing constraints, and scalable tapeout infrastructure across Intel, TSMC, Samsung, and GlobalFoundries nodes.

Location: Bay Area; on-site.

Company

hirify.global develops advanced SoC and chiplet products requiring multi-node RTL-to-GDSII design infrastructure.

What you will do

  • Architect, develop, and maintain hierarchical RTL-to-GDSII implementation flows for complex SoC designs using top-down and bottom-up methodologies.
  • Build a vendor-agnostic platform integrating Synopsys, Cadence, and Siemens EDA tools across Intel Foundry, TSMC, Samsung, and GlobalFoundries nodes.
  • Define the Reference Design and Validation Platform, design rules, constraint templates, implementation guidelines, and foundry-specific methodology through tapeout.
  • Lead low-power core methodology, including UPF/CPF flows, multi-voltage domains, level shifters, isolation, retention, power-domain verification, EM/IR, and PDN strategies.
  • Define hierarchical planning, floorplanning, partitioning, timing budgets, pin constraints, timing models, clocking architectures, synthesis, DFT integration, and STA methodology.
  • Drive CAD infrastructure improvement through automation, ML-assisted optimization, and emerging EDA capabilities while working with foundry technology teams.

Requirements

  • 15+ years of experience in ASIC CAD, design methodology, or physical design, with a record of leading multi-node, multi-foundry platform deployments.
  • Experience deploying RTL-to-GDSII platforms across external foundry nodes including TSMC N3/N5/N7, Samsung SF3/SF4, and GlobalFoundries GF12/GF22.
  • Deep expertise in low-power design methodology, including UPF/CPF flows, multi-voltage domain integration, retention strategy, and power-domain verification.
  • Expertise in Clock Mesh, Spine-and-Rib, H-Tree, and hybrid clock architectures with custom cell integration.
  • Familiarity with chiplet and 2.5D integration, die-to-die interface timing, UCIe/BoW PHY integration, and hierarchical top-level assembly flows.
  • Exceptional problem-solving and communication skills, including presenting to executive leadership and engaging directly with foundry technology teams.

Culture & Benefits

  • Full-time, on-site engineering role in the Bay Area.
  • Work directly with foundry technology teams and external EDA ecosystem partners.
  • Final hiring decisions are made by humans; AI tools may support application review and assessment.

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