Integrated Photonics Design Engineer (AI)

Location: Stuttgart, Germany

Company

hirify.global develops photonic processing systems that compute with light as an energy-efficient alternative to transistor-based architectures for AI and high-performance computing.

What you will do

• Own end-to-end integrated photonic circuit tape-outs across circuit definition, layout integration, DRC sign-off, documentation, and release.
• Coordinate with foundries and external fabrication partners on process constraints, design-rule conflicts, and execution.
• Contribute to PDK development and validation, while improving design workflows through automation, layout reuse, and review practices.
• Mentor junior engineers on photonic layout, verification, and tape-out best practices.
• Provide design insights for the photonic technology roadmap, including new components and optimization strategies.

Requirements

• Master’s degree in Photonics, Electrical Engineering, Applied Physics, or a related field with at least 3 years of industry experience; alternatively, a PhD with relevant engineering projects and at least 1 year of post-PhD industry experience.
• Hands-on experience in integrated photonics design and large-scale PIC layout from concept through tape-out.
• Experience coordinating multi-project tape-outs, including DRC, documentation, release, and foundry process constraints.
• Proficiency in photonic simulation, including FDTD, eigenmode expansion, and circuit-level simulation, plus PIC layout tooling and device physics.
• Strong Python skills for automation, verification, and design-flow improvement.
• Fluent English required; strong collaboration across architecture, characterization, packaging, electronics, and fabrication teams.

Nice to have

• PDK development experience.
• German language skills.

Culture & Benefits

• Work on photonic integrated circuit technologies for next-generation AI and HPC applications.
• Direct ownership of tape-out strategy, PDK direction, and workflow improvements.
• Collaboration with an international, cross-functional team of photonics, electronics, packaging, and fabrication experts.
• Access to company founders and senior leadership.
• Technical excellence, open communication, pragmatic problem-solving, and an inclusive work environment.