R&D Intern (RF/SAW)

Location: Teltow, Germany. Onsite role with no travel.

Company

hirify.global is a global semiconductor technology company developing products and manufacturing technologies for applications across the technology industry.

What you will do

• Support the R&D team in developing new products, tools, processes, and microwave acoustic technologies.
• Contribute to the development of CAD tools for acoustic wave devices using established programming languages.
• Contribute to process development projects for microwave acoustic devices.
• Prepare and conduct process and reliability test campaigns, then evaluate and document the results.
• Apply fundamental concepts from multiple engineering disciplines to the development and manufacturing of Surface Acoustic Wave devices for RF applications.

Requirements

• Undergraduate student in Mechanical Engineering, Electrical Engineering, Physics, or an equivalent discipline.
• 0–3 years of work experience.
• Ability to prepare and conduct tests and evaluate and document results.
• Basic knowledge of wave-propagation physics and radio-frequency design methods.
• Basic understanding of wafer-level and component packaging technologies.
• Experience with at least one of the following programming languages: C, Matlab, or Visual Basic.
• Thorough working attitude and eagerness to learn new skills and apply acquired theoretical knowledge.

Culture & Benefits

• Full-time position within an R&D team.
• Exposure to Surface Acoustic Wave devices, RF applications, and their manufacturing technologies.
• Opportunity to improve engineering skills and apply theoretical knowledge in product and process development.
• Work environment emphasizing trust, empowerment, respect, diversity, communication, employee development, and community.