Sr. Staff Thermo-Mechanical Engineer (AI)

Location: Mountain View, California, United States; flexible hybrid workplace model

Base salary: $169,000–$244,000 USD per year, plus equity and other rewards.

Company

hirify.global develops photonics-based infrastructure for AI and high-performance computing data centers, including 3D-stacked photonics engines and advanced packaging technologies.

What you will do

• Serve as the technical authority for thermo-mechanical simulation across the packaging organization.
• Develop finite element models for stress, warpage, assembly processes, solder collapse, and thermal-structural behavior in wafer-level and unit-level photonic packages.
• Identify packaging failure modes and reliability risks, including solder fatigue, delamination, CTE mismatch-driven stress, and underfill cracking.
• Design and validate material, process, and package solutions for 3D stacking, heterogeneous laser integration, fiber attach, and advanced photonics packaging.
• Drive lab-scale prototyping, characterization, and vendor experiments to validate simulation predictions against physical hardware.
• Build Python and MATLAB automation frameworks, develop analytical models, and communicate recommendations through technical reports and documentation.

Requirements

• MS or PhD in Mechanical Engineering, Materials Science, or a related engineering field.
• Deep finite element analysis expertise with Ansys, Abaqus, or equivalent commercial tools.
• Hands-on experience with thermal-structural coupling, solder joint fatigue modeling, warpage analysis, and complex multi-material assemblies.
• Strong understanding of semiconductor packaging failure modes and wafer-level or unit-level assembly processes, including flip-chip, BGA, and 3D packaging.
• Proficiency in Python and/or MATLAB for simulation automation, data analysis, and scripting.
• Experience developing analytical or semi-empirical models and leading characterization and validation programs with internal and external partners.

Nice to have

• Experience with silicon photonics, co-packaged optics, fiber attach, or heterogeneous laser integration.
• Knowledge of optical packaging reliability and optical alignment stability.
• Experience with DOE, JMP, statistical analysis, technical writing, and simulation methodology documentation.
• Ability to work independently and manage multiple projects with minimal supervision.

Culture & Benefits

• Medical, dental, and vision coverage.
• Retirement savings matching, life insurance, and disability coverage.
• Vacation, sick leave, public holidays, and paid family leave.
• Training and development support and commuter benefits.
• Equity grants for full-time employees.