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3 часа назад

Thermal Simulation Engineer (AI Hardware)

150 000 - 210 000$
Формат работы
hybrid
Тип работы
fulltime
Грейд
middle/senior
Английский
c1
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

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TL;DR
Thermal Simulation Engineer (AI Hardware): Developing and validating thermal simulation methods and training data for an AI assistant in hardware design with an accent on solver accuracy, thermal and thermoelastic modeling, and customer case validation. Focus on building test cases, generating training data, running customer simulations end to end, and collaborating closely with research and product teams.

Location

Location: Palo Alto, CA, hybrid work 2–3 days a week in person

Company

hirify.global builds an AI assistant for hardware design integrating advanced AI with engineering workflows to optimize thermal and mechanical simulations.

What you will do

  • Validate new solvers and methods against competitor FEA tools and measured data for conduction, convection, and thermoelastic stress.
  • Generate and curate training data sets for model training including geometry, materials, and boundary conditions.
  • Serve as a heavy internal user to identify bugs and workflow issues in real hardware packages and boards.
  • Run customer cases end to end, interpret results, and present findings to thermal engineers and leadership.
  • Support customer onboarding, training, and technical questions.
  • Develop internal tooling and prototypes using scripting and AI coding assistants.
  • Translate simulation results into presentations and reports for engineering leadership.
  • Provide feedback to research and product teams for feature development based on field observations.

Requirements

  • Location: Must be able to work hybrid from Palo Alto HQ 2–3 days per week.
  • BS or higher in mechanical, electrical, aerospace engineering or related technical field.
  • 3+ years experience in thermal or simulation engineering including CFD/FEA tools like Ansys Icepak, Flotherm, Fluent, COMSOL.
  • Strong knowledge of meshing strategies and ability to evaluate mesh quality.
  • Ability to reason from first principles to diagnose simulation results.
  • CAD fluency for mechanical, ECAD, or package layout geometry.
  • Strong communication skills to explain technical results to engineers and executives.
  • Coding experience in Python or similar scripting languages.

Nice to have

  • 10+ years thermal engineering experience with shipped hardware.
  • Experience in semiconductor packaging, high power-density electronics, and advanced cooling methods.
  • Customer-facing experience including demos, training, and presentations.
  • Experience building or validating solvers.
  • Comfort working in Linux environments with GPU/HPC job submission and version control.

Culture & Benefits

  • Work in a cutting-edge AI hardware startup environment.
  • Hybrid work model with office near Caltrain station in Palo Alto.
  • Occasional travel for customer and team engagements.
  • Close collaboration with researchers and GPU kernel engineers.

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