Principal Process Integration Engineer (Printed Circuit Board Assembly)

Location: Tempe, Arizona, United States of America; onsite 4 days per week

Salary: $128,800–$193,200 per year, plus eligibility for the hirify.global Incentive Plan.

Company

hirify.global develops healthcare technologies intended to alleviate pain, restore health, and extend life.

What you will do

• Lead the development, optimization, and transfer of manufacturing concepts, processes, and procedures.
• Define robust process flows and design rules for Printed Circuit Board Assembly products in collaboration with process owners and product development teams.
• Manage product-level process validation, requirements flow-down, and control and monitoring strategies.
• Identify process-interface interactions and risks, lead risk assessments and risk burn-down activities, and provide input to product and process design.
• Design and coordinate experiments and builds using statistical and science-based methods.
• Implement yield monitoring, investigate root causes, and lead corrective actions for development-related yield issues.

Requirements

• Bachelor’s degree with at least 7 years of relevant experience, or a master’s degree with at least 5 years, or a PhD with at least 3 years.
• Experience developing processes from concept through transfer to manufacturing.
• Ability to manage process validation deliverables, quality-system documentation, and regulatory compliance.
• For bachelor’s degrees earned outside the United States, a degree satisfying the requirements of 8 C.F.R. § 214.2(h)(4)(iii)(A) is required.
• U.S. work authorization sponsorship is available for Principal-level roles and above; sponsorship is subject to alignment with long-term business needs.
• Ability to work onsite four days per week and interact independently with computers, peers, and coworkers.

Nice to have

• Experience with Design Reliability Manufacturing, Design for Six Sigma, Lean Sigma, or Green/Black Belt Lean Sigma certification.
• Knowledge of design of experiments, statistical analysis, and tools such as Minitab or JMP.
• Experience with Printed Circuit Board Assembly integration.
• Exposure to microfabrication or MEMS processes, including solder printing, pick-and-place, reflow, epoxy dispense, automated visual inspection, and sizing processes.
• Advanced degree in physics, mechanical engineering, materials science, chemistry, chemical engineering, biomedical engineering, or a related discipline.

Culture & Benefits

• Work in an environment focused on patient impact, professional growth, and cross-functional collaboration.
• Health, dental, and vision insurance, plus health and dependent-care spending accounts.
• Life insurance, long-term and short-term disability coverage, paid time off, and paid holidays.
• 401(k) plan with employer contribution and match, employee stock purchase plan, and incentive plans.
• Tuition assistance or reimbursement and employee assistance resources.