Advanced Packaging Metallization Segment Leader

Location: Taoyuan, Taiwan

Company

hirify.global develops materials and solutions for advanced electronics and high-tech industries.

What you will do

• Develop and drive strategic business plans focused on revenue growth, market share expansion, profitability, and new product opportunities.
• Conduct market, competitive, and performance analysis to generate actionable insights for the Advanced Packaging business.
• Lead cross-functional initiatives across sales, product management, and internal teams to execute growth strategies.
• Translate market megatrends, OEM roadmaps, and customer technology developments into material, solution, product, and business requirements.
• Lead Voice of Customer activities to identify unmet needs, technology gaps, and future market opportunities.
• Develop digital marketing content and execute a global digital strategy to strengthen brand awareness and customer engagement.

Requirements

• Bachelor’s degree in Chemistry, Chemical Engineering, or a related analytical field.
• At least 5 years of advanced packaging experience, including extensive knowledge of WLP, 2.5D/3D packaging, fan-out, and heterogeneous integration technologies.
• At least 10 years of experience in an OEM, foundry, OSAT, design house, or equipment company.
• Significant experience in marketing, sales, or product development; technology, R&D, or applications experience is beneficial.
• Strong cross-functional leadership, customer engagement, analytical, project management, communication, and business skills.
• Fluency in English is required.

Nice to have

• Advanced degree such as an MS, PhD, or MBA.
• Experience in technology, R&D, or applications.

Culture & Benefits

• Fast-paced, continuously changing environment focused on innovation and practical execution.
• Comprehensive pay and benefits package.
• Work with diverse, cross-functional teams developing solutions for advanced electronics.