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12 часов назад

Electrical Engineer (Wearable Hardware)

80 000 - 100 000CNY
Формат работы
onsite
Тип работы
fulltime
Английский
b2
Страна
China
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Текст:
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TL;DR
Electrical Engineer (Wearable Hardware) (PCB and power systems): Designing dense, high-speed mixed-signal boards and power systems for wearable capture hardware with an accent on rigid-flex PCBs, compute module integration, battery systems, and sensor arrays. Focus on signal and power integrity, EMI and crosstalk control, board bring-up, debugging, and production-ready DFM.

Location: China; onsite

Salary: CN¥80K–CN¥100K, plus equity

Company

hirify.global is a Y Combinator-backed research lab building custom hardware and learned models of human embodied intelligence for robotics and scientific research.

What you will do

  • Own electrical design from schematics through board bring-up and production-ready DFM.
  • Design custom carrier boards for ARM compute modules and route high-speed interfaces including MIPI CSI-2, SerDes, USB 3.x, PCIe, and UFS.
  • Develop rigid-flex and high-density PCBs with controlled impedance, low crosstalk, and EMI performance.
  • Design power delivery networks, battery management, fuel gauging, runtime estimation, and power sequencing for wearable loads.
  • Integrate multi-camera arrays and inertial, magnetic, acoustic, and environmental sensors.
  • Coordinate firmware bring-up, diagnose signal integrity, power integrity, and timing issues, and support EMC compliance validation.

Requirements

  • Strong PCB design experience with Altium, Cadence Allegro, or KiCad.
  • Experience with high-speed digital design, differential pair routing, impedance control, and PCB stack-ups.
  • Experience with SI/PI simulation and validation.
  • Experience designing compute module or SoM carrier boards.
  • Practical lab debugging skills using oscilloscopes, logic analyzers, and network analyzers.
  • Ability to work onsite in China.

Nice to have

  • Multi-camera array design supporting three or more concurrent cameras.
  • High-speed SerDes routing and ARM SoC carrier work with Qualcomm, NXP, or similar platforms.
  • Wearable or body-worn product experience.
  • Hot-swap power design.
  • FCC, CE, or RoHS compliance and DFM handoff experience.

Culture & Benefits

  • Lean, deeply technical research environment backed by Y Combinator.
  • Fast iteration on technically difficult hardware and embodied-intelligence problems.
  • Meaningful ownership of systems from the first day.
  • Designed boards are deployed in real wearable products used by people.
  • Equity is included in the compensation package.

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