18 часов назад
Director, Hardware Design Engineering — AEC / SCM & China Customer Support
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
Director, Hardware Design Engineering — AEC / SCM & China Customer Support (High-Speed Interconnects): Establishing and leading a Shanghai hardware design center for AEC and SCM products, from architecture through production release, while supporting China-based customers with design reviews, integration, validation, and deployment. with an accent on 112G/224G PAM4 electrical design, mechanical and thermal engineering, manufacturing collaboration, and customer enablement. Focus on building a multidisciplinary team, developing local lab infrastructure, solving high-speed signal integrity and reliability challenges, and driving next-generation interconnect products.
Location: Shanghai, China; based in Shanghai with 30–40% travel to customer sites and contract manufacturing facilities across China, plus periodic travel to US and Taiwan offices
Company
provides semiconductor-based connectivity solutions and software for rack-scale AI infrastructure, including AEC, SCM, CXL, Ethernet, NVLink, PCIe, and UALink technologies.
What you will do
- Establish and lead the Shanghai hardware design center and build a multidisciplinary engineering organization.
- Own AEC and SCM hardware design execution from architecture through qualification, production release, and volume manufacturing.
- Lead high-speed electrical, flex, substrate, mechanical, thermal, cable interface, and power delivery design for 112G and 224G PAM4 products.
- Direct hardware validation, qualification, failure analysis, lab infrastructure, and design-for-manufacturing activities with China-based contract manufacturers.
- Provide customer engineering support for China-based hyperscalers, OEMs, system integrators, cable manufacturers, and module partners.
- Coordinate with global hardware, signal integrity, firmware, manufacturing, sales, FAE, and product management teams on roadmaps, integration, and customer requirements.
Requirements
- Bachelor’s degree in Electrical Engineering, Mechanical Engineering, or a related technical discipline.
- 15+ years of progressive hardware design engineering experience with high-speed interconnect products and 5+ years leading multidisciplinary engineering teams.
- Expertise in high-speed flex, rigid-flex, or substrate design at 56G/112G PAM4 or above, plus mechanical design for cable modules or pluggable transceivers.
- Experience delivering high-speed serial-link products through architecture, qualification, and volume production, including validation and qualification programs.
- Experience working with China-based contract manufacturers and in customer-facing technical roles such as design reviews, applications engineering, or semiconductor/interconnect customer support.
- Native or fluent Mandarin Chinese and professional English proficiency required.
Nice to have
- Experience with AEC, active copper cables, SCMs, retimer/re-driver integration, optical transceivers, or 224G/lane interconnect technology.
- Knowledge of OSFP, QSFP-DD, CMIS, SFF-8636, IEEE 802.3ck/dj, and OIF CEI-112G/224G standards.
- Established relationships with China-based hyperscalers, server/switch OEMs, cable manufacturers, or module partners.
- Experience with flex and rigid-flex PCB tools, EDA tools, cable construction, and China-specific regulatory or procurement requirements.
Culture & Benefits
- Build a new Shanghai engineering site in close proximity to China-based customers and manufacturing partners.
- Develop local lab capabilities for high-speed characterization, validation, mechanical testing, reliability testing, prototyping, and customer interoperability demonstrations.
- Collaborate across Shanghai, Santa Clara, and Taiwan design centers.
- Represent hardware engineering with customers, manufacturing partners, suppliers, and industry stakeholders across China.
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